Controlled-impedance out-of-substrate package structures employing electrical devices, and related assemblies, components, and methods

摘要

Controlled-impedance out-of-substrate package structures employing electrical devices and related assemblies, components, and methods are disclosed. An out-of-substrate package structure may be used to electrically couple an electrical device to an electrical substrate, for example a printed circuit board. The out-of-substrate package structure may be electrically coupled to the electrical substrate. Ground paths of the out-of-substrate package structure may be arranged proximate to the electrical device and arranged symmetric with respect to at least one geometric plane intersecting the electrical device. In this regard, electric field lines generated by current flowing into the electrical device tend to terminate at the return or ground paths allowing for impedance to be more easily controlled. Accordingly, the out-of-substrate package structure may be impedance matched in a better way with respect to power provided from the electrical substrate enabling faster electrical device speeds.

主权项

1. A controlled-impedance out-of-substrate package structure mountable on an electrical substrate, comprising:
a signal path configured to be electrically coupled to a signal pad of an electrical substrate; ground paths configured to be electrically coupled to at least one ground plane of the electrical substrate; and an electrical device configured to be electrically coupled to the signal path and to at least one of the ground paths, wherein the ground paths are arranged proximate to the electrical device and arranged symmetric with respect to at least one geometric plane intersecting the electrical device to control impedance, and wherein the ground paths are connected by a ground arch arranged proximate to the electrical device and symmetric with respect to the at least one geometric plane intersecting the electrical device to control impedance.