| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can maintain efficiency of heat rejection at the time of driving while inhibiting residual stress on a semiconductor chip, which occurs at the time of manufacture.SOLUTION: A bonded body 5 comprises: a pair of bonded parts 51, 51 which are arranged to sandwich a sub-mount 3 and bonded to side parts of the sub-mount 3; and a connecting part 52 where the pair of bonded parts 51, 51 are arranged along a direction to sandwich the sub-mount 3, for connecting the pair of bonded parts 51, 51. When a coefficient of linear thermal expansion of the sub-mount 3 is larger than a coefficient of linear thermal expansion of a semiconductor chip 2 in the sandwiching direction, a coefficient of linear thermal expansion of at least the connecting part 52 of the bonded body 5 is smaller than the coefficient of linear thermal expansion of the sub-mount 3 in the sandwiching direction. |
