| 摘要 |
<p>A sintered sputtering target having a structure in which metal phases and oxide phases are homogeneously dispersed, the sputtering target being characterized in that the metal phases contain Co, Pt and Mn as components and the oxide phases contain an oxide having at least Mn as a constituent. The sputtering target has the excellent effects of being able to reduce the amount of particles generated during sputtering and of being able to improve yield during film deposition.</p> |
