发明名称 |
Mounting member having die pad unit and terminals, and photocoupler having the mounting member |
摘要 |
A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another. |
申请公布号 |
US9171969(B2) |
申请公布日期 |
2015.10.27 |
申请号 |
US201414162145 |
申请日期 |
2014.01.23 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Yamamoto Mami;Noguchi Yoshio |
分类号 |
H01L27/15;H01L29/16;H01L31/12;H01L33/00;H01L23/48;H01L23/52;H01L29/40;G02B27/00;G02B6/26;G02B6/42;H01L31/02;H01L31/173 |
主分类号 |
H01L27/15 |
代理机构 |
White & Case LLP |
代理人 |
White & Case LLP |
主权项 |
1. A photocoupler comprising:
a mounting member including:
an insulating substrate having a first surface, a second surface opposite to the first surface, a first side surface, a second side surface opposite to the first side surface, a third side surface, and a fourth side surface opposite to the third side surface;a first terminal provided on the first side surface, the first surface, and the second surface, a first portion of the first terminal on the first surface including a first conductive region including Au or Ag, and a second conductive region of the first portion including at least one of Cu, Ni, and Pd;a second terminal provided on the second side surface, the first surface, and the second surface and insulated from the first terminal, a second portion of the second terminal on the first surface including a third conductive region including Au or Ag, and a fourth conductive region including at least one of Cu, Ni, and Pd; a light receiving element the mounting member; a light emitting element provided on the light receiving element; a bonding layer having transparency and insulating property and being provided between the light emitting element and the light receiving element; and a sealing resin layer covering the light receiving element, the light emitting element, the first surface of the insulating substrate, the second conductive region, and the fourth conductive region. |
地址 |
Minato-Ku, Tokyo JP |