Electronic device module with integrated antenna structure, and related manufacturing method

摘要

An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module.

主权项

1. An electronic device module comprising:
an electronic device package having device contacts, the electronic device package fixed within encapsulating material; an electrically conductive ground layer fixed within the encapsulating material, the ground layer having a device opening in which the electronic device package resides, and the ground layer having an antenna opening spaced apart from the device opening, wherein the device contacts and one side of the ground layer correspond to a first surface; and a patch antenna element overlying the first surface and coupled to the electronic device package, wherein a projection of the patch antenna element onto the first surface resides within the antenna opening.