发明名称 BENDING APPARATUS FOR HEAT TRANSFER DEVICE OF FLAT TYPE
摘要 The present invention relates to a bending apparatus for a planar heat transfer device. The present invention comprises: a base; a vice having a device insertion groove of which a width can be controlled while one side of a planar heat transfer device is inserted into the groove and varying the width of the device insertion groove to hold one side of the planar heat transfer device while the planar heat transfer device is compressed and fixated to be rotated to the base to be rotated while holding one side of the heat transfer device and bends one side of the planar heat transfer device; and the other side supporter supporting the other side of the planar heat transfer device exposed to the outside of the vice to prevent the other side of the planar heat transfer device from being rotated.The present invention easily bends the planar heat transfer device.
申请公布号 KR101563669(B1) 申请公布日期 2015.10.27
申请号 KR20140056199 申请日期 2014.05.12
申请人 TOP THERMAL MANAGEMENT CO., LTD. 发明人 CHA, JUN SUN;JUNG, SUN HO;CHOI, EU GENE
分类号 B21D7/04;B21D7/16 主分类号 B21D7/04
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