发明名称 TRANSFER APPARATUS, AND ELECTRONIC DEVICE FORMING METHOD
摘要 This transfer apparatus for transferring a substrate is provided with: a supporting member, which has a supporting surface that supports one surface of the substrate, and which has a plurality of through holes formed therein, said through holes penetrating between the supporting surface and the surface on the reverse side of the supporting surface; and a holding mechanism, which is provided with a gas suction section disposed to face a first region of the rear surface of the supporting member, said first region including the holes, and a gas supply section disposed to face a second region of the rear surface of the supporting member, said second region being different from the first region, and which holds the rear surface of the supporting member in a non-contact state and sucks the substrate to the supporting surface via the through holes by supplying and sucking a gas with respect to the rear surface of the supporting member.
申请公布号 HK1203183(A1) 申请公布日期 2015.10.23
申请号 HK20150103065 申请日期 2015.03.26
申请人 NIKON CORPORATION 发明人 TOMONARI SUZUKI
分类号 B65G;H01L;H05B 主分类号 B65G
代理机构 代理人
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