| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce temperature variations of a substrate placed on a substrate placement surface.SOLUTION: A substrate W is placed on a substrate placement surface 11a of an electrostatic chuck substrate 10. The electrostatic chuck substrate 10 has a resistance heating element 13 which heats the substrate W. The electrostatic chuck substrate 10 is bonded to an upper surface 30a of a base plate 30 by an adhesive layer 20. Through holes 32 which penetrate from the upper surface 30a to a lower surface 30b is formed at the base plate 30. Through holes 21 respectively communicating with the through holes 32 of the base plate 30 are formed on the adhesive layer 20. Adjustment rods 40, each of which is inserted into the through hole 32 and has a tip 40a disposed in the through hole 21 of the adhesive layer 20, are supported on the base plate 30.</p> |
