THERMAL INTERFACE MATERIAL ASSEMBLIES AND RELATED METHODS

摘要

Example embodiments of the present disclosure generally relate to thermal interface material assemblies. In an example embodiment, a thermal interface material assembly generally includes a substrate and one or more pillars along a first and/or second side portion of the substrate.

主权项

1. A thermal interface material assembly comprising:
a substrate; one or more thermally-conductive pillars along the substrate; and a thermally-conductive heat path at least partially defined by the substrate and the one or more thermally-conductive pillars, whereby heat may be transferrable along the thermally-conductive heat path from a heat source of an electronic device.