| 发明名称 |
PACKAGE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND IMAGING MODULE |
| 摘要 |
There are provided a package for mounting an electronic element which can be reduced in size and an electronic device. A package for mounting an electronic element includes an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad; and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. Consequently, the package for mounting an electronic element can be reduced in size, and is capable of suppressing electrical short-circuiting between the wiring conductor and an electronic element and of suppressing occurrence of a crack in the insulating base. |
| 申请公布号 |
US2015305160(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201414439423 |
申请日期 |
2014.01.22 |
| 申请人 |
KYOCERA CORPORATION |
发明人 |
FUNAHASHI Akihiko;HORIUCHI Kanae;MORIYAMA Yousuke |
| 分类号 |
H05K1/18;H05K1/02;H04N5/225;H05K1/11 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package for mounting an electronic element, comprising:
an insulating base having a frame section; an electrode pad disposed on an tipper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad: and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. |
| 地址 |
Kyoto-shi, Kyoto JP |
