Light Emitting Diode Assembly With Integrated Circuit Element

摘要

An LED assembly with an ESD protection device integrated into the carrier substrate and a method for making the LED assembly is disclosed. In one embodiment, the LED assembly includes an LED in contact with a bonding layer in contact with a substrate. The substrate has a region containing a circuit element. The bonding layer forms an ohmic connection between the region containing the circuit element and the LED. In one embodiment, the region containing the circuit element is an ESD protection device, such as a Zener diode.

主权项

1. A light emitting diode (LED) assembly comprising:
a substrate comprising a region forming a circuit element; an intervening layer formed on a surface of the substrate; and an LED formed on the intervening layer, wherein the intervening layer forms an ohmic connection between the region and the LED.