发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface (6) parallel to a lamination direction of a semiconductor layer (2). The semiconductor light emitting device includes a light guide member (3) placed on the semiconductor layer (2) and having a sloped surface (7) with a side surface opposite to the light extraction surface (6) sloped to the light extraction surface and a light-reflecting member (4) placed on a surface of the light guide member including at least the sloped surface of the light guide member. |
申请公布号 |
US2015303356(A1) |
申请公布日期 |
2015.10.22 |
申请号 |
US201514690138 |
申请日期 |
2015.04.17 |
申请人 |
Nichia Corporation |
发明人 |
SANGA Daisuke;OKA Yuta |
分类号 |
H01L33/50;H01L33/46;H01L33/38;H01L33/00 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor light emitting device having a light extraction surface parallel to a lamination direction of a semiconductor layer being a laminated body, the device, comprising:
a light guide member placed on the semiconductor layer and having a first sloped surface that is a side surface opposite to the light extraction surface and sloped to the light extraction surface; a light-reflecting member placed on a surface of the light guide member including at least the first sloped surface of the light guide member; and a light-reflecting package opening a side of the light extraction surface and covering a side surface of the semiconductor layer and the light guide member. |
地址 |
Anan-shi JP |