| 摘要 |
A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover. |
| 主权项 |
1. A micro-electro-mechanical system (MEMS) microphone, the microphone comprising:
a rectangular substrate comprising:
a rigid base layer comprised of multiple sub-layers of non-conductive material, wherein the base layer has a planar top surface and a planar bottom surface, the top surface having an interior region and an attachment region, the attachment region disposed between the interior region and the edges of the base layer, and completely bounding the interior region;a first metal layer disposed on the top surface of the base layer and defined by a first solder mask layer;a second metal layer disposed on the bottom surface of the base layer and defined by a second solder mask layer into a plurality of flat conductive pads, the second plurality of flat conductive pads arranged to be within a perimeter of the bottom surface of the base layer;one or more electrical pathways disposed completely within the base layer;an acoustic port disposed in the interior region of the base layer and passing completely through the base layer, wherein the acoustic port is disposed in a position offset from a centerpoint of the substrate, and wherein one of the plurality of conductive pads is a metal ring that completely surrounds the acoustic port in the base layer and has an inner diameter that is greater than the diameter of the acoustic port; anda patterned flexible printed circuit board material sandwiched between the sub-layers of the base layer, the flexible printed circuit board material having openings that substantially block contaminants from passing through the acoustic port; a MEMS microphone die mounted to the top surface of the substrate, the MEMS microphone die being disposed directly over the acoustic port in the base layer, wherein the one or more electrical pathways electrically couple the MEMS microphone die to the plurality of conductive pads on the bottom surface of the base layer; and a solid single-piece rectangular cover having a predetermined shape, the rectangular cover comprising a top portion and a substantially vertical and continuous sidewall portion that adjoins the top portion at an angle and that completely surrounds and supports the top portion, the sidewall portion having a predetermined height, an exterior sidewall surface, an interior sidewall surface, and an attachment surface,
wherein the attachment surface of the sidewall portion of the cover is aligned with and attached to the attachment region of the top surface of the base layer of the substrate, wherein the attachment surface of the sidewall portion is in contact with the first metal layer; andwherein the predetermined height of the sidewall portion of the cover, the interior sidewall surface of the sidewall portion of the cover, and the interior surface of the top portion of the cover, in cooperation with the interior region of the top surface of the base layer, defines an acoustic chamber for the MEMS microphone die. |
