340 GHz MULTIPIXEL TRANSCEIVER

摘要

A multi-pixel terahertz transceiver is constructed using a stack of semiconductor layers that communicate using vias defined within the semiconductor layers. By using a stack of semiconductor layers, the various electrical functions of each layer can be tested easily without having to assemble the entire transceiver. In addition, the design allows the production of a transceiver having pixels set 10 mm apart.

主权项

1. A multi-pixel terahertz transceiver, comprising:
a plurality of layers of a semiconductor in a stacked array, each of said plurality of layers of said semiconductor in said stacked array configured to perform less than all the functions of the transceiver, each of said plurality of layers of a semiconductor in said stacked array when in an assembled structure in electromagnetic communication with at least one other of said plurality of layers of a semiconductor in said stacked array; a local oscillator in electrical communication with said plurality of layers of said semiconductor in said stacked array and configured to provide an oscillation signal for each of a transmitted signal and a received signal; a biasing terminal for applying biasing signals in electrical communication with at least one of said plurality of layers of said semiconductor in said stacked array; an IF output terminal in electrical communication with at least one of said plurality of layers of said semiconductor in said stacked array; and an antenna array configured to transmit and to receive a plurality of terahertz signals.