FLUXING UNDERFILL COMPOSITION AND SMT METHOD USING THE SAME

摘要

The present invention relates to a fluxing underfill composition and surface mount technology (SMT) method using the same. Surface mounting technology according to the present invention provides a fluxing underfill composition to a processing capable of not including a separate fluxing process and an underfill process. Surface mounting technology according to one embodiment comprises: a process for dipping parts into the fluxing underfill compositiong; a process for mounting the dipped parts into the underfill composition; and a process for soldering coming into contact with the parts.