发明名称 RF Power Transistor
摘要 A semiconductor device including an RF power transistor in a semiconductor package is described. The semiconductor device comprises a gate lead frame, a drain lead frame, a die including a power transistor having a gate and a drain and a flange. A gate impedance matching network is connected between the gate lead frame and the gate. A drain impedance matching network is connected between the drain lead frame and the drain and includes a drain lead frame bond wire between the drain lead frame and the drain. A first conducting element is connected between the die and the flange and is arranged to provide a current path along which a return current can flow in use to lower an inductance associated with the drain lead frame bond wire.
申请公布号 US2015294930(A1) 申请公布日期 2015.10.15
申请号 US201514667860 申请日期 2015.03.25
申请人 NXP B.V. 发明人 Zhu Yi
分类号 H01L23/495;H01L29/78 主分类号 H01L23/495
代理机构 代理人
主权项 1. A semiconductor device comprising an RF power transistor in a semiconductor package, comprising: a gate lead frame; a drain lead frame; a die including an RF power transistor having a gate and a drain; a flange; a gate impedance matching network connected between the gate lead frame and the gate; and a drain impedance matching network connected between the drain lead frame and the drain, the drain impedance matching network including a drain lead frame bond wire between the drain lead frame and the drain, and a first conducting element electrically connected at both a first end and a second end to the flange and arranged to provide a current path along which a return current can flow in use to lower an inductance associated with the drain lead frame bond wire.
地址 Eindhoven NL