发明名称 |
MEMS JET INJECTION STRUCTURE FOR HIGH DENSITY PACKAGING |
摘要 |
PROBLEM TO BE SOLVED: To provide a liquid injector which enables electric connection of a droplet injection module on a die having an area which is reduced resulting from improvement of the nozzle density in the droplet injection module and utilized for electric connection.SOLUTION: A liquid injector 100 includes a liquid injection module 103 having a substrate 122 and a layer separated from the substrate. The substrate includes multiple liquid injection elements 401 arranged in a matrix. Each liquid injection element is formed so as to cause a liquid to be emitted from a nozzle. The layer separated from the substrate has multiple electric connections. Each electric connection is located adjacent to the corresponding liquid injection element. |
申请公布号 |
JP2015180551(A) |
申请公布日期 |
2015.10.15 |
申请号 |
JP20150121791 |
申请日期 |
2015.06.17 |
申请人 |
FUJIFILM DIMATIX INC |
发明人 |
BIBL ANDREAS;ESSEN KEVIN VON;HOISINGTON PAUL A |
分类号 |
B41J2/14;B41J2/145 |
主分类号 |
B41J2/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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