发明名称 MEMS JET INJECTION STRUCTURE FOR HIGH DENSITY PACKAGING
摘要 PROBLEM TO BE SOLVED: To provide a liquid injector which enables electric connection of a droplet injection module on a die having an area which is reduced resulting from improvement of the nozzle density in the droplet injection module and utilized for electric connection.SOLUTION: A liquid injector 100 includes a liquid injection module 103 having a substrate 122 and a layer separated from the substrate. The substrate includes multiple liquid injection elements 401 arranged in a matrix. Each liquid injection element is formed so as to cause a liquid to be emitted from a nozzle. The layer separated from the substrate has multiple electric connections. Each electric connection is located adjacent to the corresponding liquid injection element.
申请公布号 JP2015180551(A) 申请公布日期 2015.10.15
申请号 JP20150121791 申请日期 2015.06.17
申请人 FUJIFILM DIMATIX INC 发明人 BIBL ANDREAS;ESSEN KEVIN VON;HOISINGTON PAUL A
分类号 B41J2/14;B41J2/145 主分类号 B41J2/14
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