| 摘要 |
The present invention relates to a method for slicing wafers from a workpiece by using a sawing wire wherein at least two wire guide rolls clamp a wire web. Each wire guide roll comprises a plurality of grooves on a horizontal surface of each wire guide roll wherein at least one groove into which a wire is not inserted during wire sawing is in parallel with a wire-guide groove and sawing wires are wound respectively on previously unoccupied grooves which are not abraded or used after abrasion of wire-guide grooves or a defined number of sawing processes. |
