发明名称 |
Power module package and method for manufacturing the same |
摘要 |
Disclosed herein are a power module package and a method for manufacturing the same. According to a preferred embodiment of the present invention, a power module package includes: a metal substrate having an insulating layer and a circuit pattern formed on one surface thereof; at least one first electronic device mounted on the circuit pattern; a lead frame disposed around the metal substrate; a molding area enclosing the metal substrate, the first electronic device, and a portion of the lead frame; and a heat sink including a connection part contacting the insulating layer and a body part disposed on a surface opposite to the first electronic device and including one surface bonded to the connection part and the other surface exposed from an upper surface of the molding area. |
申请公布号 |
US9161479(B2) |
申请公布日期 |
2015.10.13 |
申请号 |
US201414317469 |
申请日期 |
2014.06.27 |
申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
Jang Bum Sik;Song Sung Min |
分类号 |
H01L25/00;H05K7/20;H05K7/02;B29C65/70;H01L23/48;B29K101/10;B29L31/18;H01L23/40 |
主分类号 |
H01L25/00 |
代理机构 |
Ladas & Parry, LLP |
代理人 |
Ladas & Parry, LLP |
主权项 |
1. A power module package, comprising:
a metal substrate having an insulating layer and a circuit pattern formed on one surface thereof; at least one first electronic device mounted on the circuit pattern; a lead frame disposed around the metal substrate; a molding area enclosing the metal substrate, the first electronic device, and a portion of the lead frame; and a heat sink including a connection part contacting the insulating layer and a body part disposed on a surface opposite to the first electronic device and including one surface bonded to the connection part and the other surface exposed from an upper surface of the molding area. |
地址 |
Gyeonggi-Do KR |