| 摘要 |
Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from a panel of unsingulated substrates, and each MEMS microphone die is substrate-mounted. Individual covers, each with an acoustic port, are joined to the panel of unsingulated substrates. Each individual substrate and cover pair cooperates to form an acoustic chamber for its respective MEMS microphone die, which is acoustically coupled to the acoustic port in the cover. The completed panel is singulated to form individual MEMS microphones. |
| 主权项 |
1. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the microphone comprising:
providing an unsingulated panel comprised of a plurality of individual rectangular substrates, each rectangular substrate comprising:
a base layer comprised of at least one layer of non-conductive material, wherein the base layer has a planar top surface and a planar bottom surface, the top surface having an interior region and an attachment region, the attachment region disposed between the interior region and the edges of the base layer, and completely bounding the interior region;a first plurality of metal pads disposed on the top surface of the base layer;a second plurality of flat metal pads disposed on the bottom surface of the base layer, the second plurality of metal pads arranged to be within a perimeter of the bottom surface of the base layer; andone or more electrical pathways disposed completely within the base layer, wherein the pathways electrically couple one or more of the first plurality of metal pads on the top surface of the base layer to one or more of the second plurality of metal pads on the bottom surface of the base layer; mounting a MEMS microphone die to the top surface of each individual substrate in the panel of unsingulated substrates, and electrically coupling the MEMS microphone die to at least one of the first plurality of metal pads on the top surface of its respective substrate; providing a plurality of single-piece rectangular covers, wherein each individual rectangular cover is formed from a solid material and has a top portion and a sidewall portion, the sidewall portion supporting the top portion and adjoining the top portion at a substantially perpendicular angle and having a predetermined height, an exterior surface, an interior surface, an attachment surface, and an acoustic port disposed in the top portion of the rectangular cover and passing completely through the rectangular cover, wherein the acoustic port is disposed in a position offset from a centerpoint of the rectangular cover; attaching a single-piece rectangular cover to each individual substrate on the panel of unsingulated substrates, one cover to each individual substrate,
wherein the attachment surface of the sidewall portion of the rectangular cover is aligned with and attached to the attachment region of the top surface of its respective individual substrate, andwherein the predetermined height and interior surface of the sidewall portion of the rectangular cover, and the interior surface of the top portion, in cooperation with the interior region of the top surface of its respective individual substrate, forms a protective enclosure for the MEMS microphone die to reduce electromagnetic interference and to define an acoustic chamber for the MEMS microphone die; and singulating the substrate panel into individual MEMS microphones. |
