发明名称 |
Millimeter wave wafer level chip scale packaging (WLCSP) device and related method |
摘要 |
Various embodiments include wafer level chip scale package (WLCSP) structures and methods of tuning such structures. In some embodiments, the WLCSP structure includes: a printed circuit board (PCB) trace connection including at least one PCB ground connection connected with a PCB ground plane; a set of ground solder balls each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground solder balls in the set of ground solder balls; a chip ground plane connecting the set of chip pads; and a signal interconnect interposed between two of the set of ground solder balls, the signal interconnect including: a signal trace connection electrically isolated from the PCB ground plane; a signal ball contacting the signal PCB trace connection; a chip pad contacting the signal ball, and a signal trace connection on a chip contacting the chip pad. |
申请公布号 |
US9159692(B2) |
申请公布日期 |
2015.10.13 |
申请号 |
US201414519590 |
申请日期 |
2014.10.21 |
申请人 |
International Business Machines Corporation |
发明人 |
Ding Hanyi;Graf Richard S.;Hill Gary R.;Woods, Jr. Wayne H. |
分类号 |
H01L23/492;H01L23/00;H01L23/498;H01L23/522;H01L23/66;H01L21/66;H01L23/31 |
主分类号 |
H01L23/492 |
代理机构 |
Hoffman Warnick LLC |
代理人 |
Cain David A.;Hoffman Warnick LLC |
主权项 |
1. A method of tuning a wafer level chip scale package (WLCSP) structure, the method comprising:
providing the WLCSP structure including: a printed circuit board (PCB) trace connection including at least one PCB ground connection connected with a PCB ground plane, wherein the PCB ground plane includes an opening; a set of ground contact devices each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground contact devices in the set of contact devices; a chip ground plane connecting the set of chip pads, the chip ground plane including an opening; and a signal interconnect interposed between two of the set of ground contact devices, the signal interconnect including: a signal trace connection electrically isolated from the PCB ground plane; a signal contact device contacting the signal trace connection; a chip pad contacting the signal contact device; and a signal trace connection on a chip contacting the chip pad; determining a performance parameter of the WLCSP structure; tuning a size of at least one of the opening in the PCB ground plane or the opening in the chip ground plane based upon the determined performance parameter; and modifying a size of the signal contact device and the ground contact devices based upon the determined performance parameter. |
地址 |
Armonk NY US |