| 摘要 |
A plasticized ceramic thermal dissipation module comprises a heating electrical component (1), a cooling body (2), and a thermal conductive device (3). They are located orderly. The thermal conductive device is a substrate (e.g. a high thermal conductive circuit board or a LED module board) and the heating electrical component is arranged on the substrate, in which the cooling body is a plasticized ceramic and seamlessly integrated with the thermal conductive device together as a component (All-In-One). The present invention efficiently integrates electrical circuits (or package) board with cooling body together, may be able to simplify the assembling process during the late production stage, to decrease the thermal resistance between the two components during assembling and efficiently enhances the thermal conductive performance, furthermore, the plasticized ceramic with high thermal conductive coefficient has excellent lateral thermal conductive ability to enhance the cooling performance, and be able to integrate with different types of circuits (or package) boards together to increase product's productivity and design flexibility. |
