METHOD INSERTING STRUCTURE IN THE SUBSTRATE AND MICROFLUIDIC CHIP USING THE SAME

摘要

The present invention relates to a method for inserting a structure in a substrate and a microfluidic chip manufactured by using the method. More specifically, the present invention relates to a method for puncturing a part, which is to have the structure inserted therein, of a microfluidic chip substrate to insert the structure and finish the part by injecting an adhesive from the rear surface of the structure, and to a microfluidic chip manufactured by using the method. According to the present invention, a method for manufacturing the microfluidic chip using the structure insertion includes the steps of: arranging a second substrate which is coupled with a first substrate and has a hole formed to insert the structure; inserting the structure to the hole; and fixing the structure in the hole.