| 发明名称 |
Laser Diode Assembly |
| 摘要 |
A laser diode assembly includes a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part. The laser diode chip has, on a substrate, semiconductor layers with an active layer for emitting light. The housing part and the mounting part have a main body composed of copper and at least the housing part is steel-sheathed. A first solder layer having a thickness of greater than or equal to 3 μm is arranged between the laser diode chip and the mounting part. |
| 申请公布号 |
US2015288138(A1) |
申请公布日期 |
2015.10.08 |
| 申请号 |
US201414496975 |
申请日期 |
2014.09.25 |
| 申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Strauss Uwe;Tautz Soenke;Lell Alfred;Auen Karsten;Vierheilig Clemens |
| 分类号 |
H01S5/022;H01S5/323;H01S5/024 |
主分类号 |
H01S5/022 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A laser diode assembly comprising:
a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction; a laser diode chip disposed on the mounting part, the laser diode chip having semiconductor layers on a substrate, wherein the semiconductor layers include an active layer for emitting light, wherein the laser diode chip is based on a nitride compound semiconductor material; and a first solder layer arranged between the laser diode chip and the mounting part, the first solder layer having a thickness of greater than or equal to 3 μm. |
| 地址 |
Regensburg DE |
