发明名称 LOW-COST ULTRA WIDEBAND LTE ANTENNA
摘要 An antenna capable of operating among all LTE bands, and also capable of operation among all remote side cellular applications, such as GSM, AMPS, GPRS, CDMA, WCDMA, UMTS, and HSPA among others. The antenna provides a low cost alternative to active-tunable antennas suggested in the prior art for the same multi-platform objective.
申请公布号 US2015288059(A1) 申请公布日期 2015.10.08
申请号 US201314438611 申请日期 2013.10.08
申请人 ZUNIGA Eleazar 发明人 Zuniga Eleazar
分类号 H01Q1/38;H01Q5/10;H01Q5/364 主分类号 H01Q1/38
代理机构 代理人
主权项 1. An antenna, comprising: a six-sided rectangular substrate volume (S) having a bottom, rear, top, front, left and right surface thereof; and an antenna trace (T) disposed on said substrate volume; characterized in that: said antenna trace extends about said bottom, rear, top, and front surfaces of the substrate; the antenna trace comprising: a first bottom conductor plate (11) disposed on a right-side terminus (250) of the bottom surface;a second bottom conductor plate (20) disposed on a left-side terminus (255) of the bottom surface;a feed conductor (30) extending between a bottom-front periphery (B-F′) and a bottom-rear periphery (B-R′) of the substrate, the feed conductor being disposed between said first and second bottom conductor plates on the bottom surface; the first bottom conductor plate further comprising a first conductive element (12) extending outwardly therefrom toward the feed conductor along the bottom-rear periphery of the substrate;a ground conductor (40) disposed between the feed conductor and the second bottom conductive plate on the bottom surface; the ground conductor being oriented perpendicular with respect to the feed conductor;a first vertical conductor element (52) disposed on the rear surface and extending from the bottom-rear periphery to a top-rear periphery (T-R′) of the substrate;a high frequency element (50) disposed on the rear surface of the substrate, the high frequency element including: a first vertical conductor plate (51) disposed on a right-side terminus of the rear surface of the substrate, the first vertical conductor plate being coupled with the first bottom conductor plate at the bottom-rear periphery of the substrate, the first vertical conductor plate extending perpendicularly from the first bottom conductor plate, the first vertical conductor element being coupled to the first vertical conductor plate via a first connection element (53) extending therebetween along the bottom-rear periphery of the substrate;the first connection element being further coupled to the feed conductor at the bottom-rear periphery of the substrate; anda second conductive element (54) extending outwardly from the first vertical conductive plate, the second conductive element being oriented parallel with respect to the first connection element and separated therefrom by a first rear gap (2a) extending therebetween, the second conductive element further separated from the first vertical conductor element by a second rear gap (2b) extending therebetween, the second conductive element being further separated from the top-rear periphery by a third rear gap (2c) extending therebetween;a first loop conductor (60) having a first vertical portion (61) extending from the bottom-rear periphery to the top-rear periphery, a second vertical portion (63) extending from the bottom-rear periphery to the top-rear periphery, and a first loop connection (62) extending between the first and second vertical portions along the bottom rear periphery, the first vertical portion of the first loop conductor being disposed parallel with the first vertical conductor element and separated therefrom by a fourth rear gap (2d) extending therebetween, the second vertical portion being disposed parallel with the first vertical portion and separated therefrom by a fifth rear gap (2e) extending therebetween;a low frequency element (70) disposed on the rear surface of the substrate, the low frequency element including: a second vertical conductor plate (71) disposed on a left-side terminus of the rear surface of the substrate, the second vertical conductor plate being coupled with the second bottom conductor plate at the bottom-rear periphery of the substrate, the second vertical conductor plate extending perpendicularly from the second bottom conductor plate; anda second vertical conductor element (73) disposed on the rear surface and extending from the bottom-rear periphery to the top-rear periphery of the substrate, the second vertical conductor element being coupled to the second vertical conductor plate via a second connection element (72) extending therebetween along the bottom-rear periphery of the substrate;the second vertical conductor element being disposed parallel with the second vertical portion of the first loop conductor and separated therefrom by a sixth rear gap (2f) extending therebetween;the second vertical conductor element being further separated from the second vertical conductor plate by a seventh rear gap (2g) extending therebetween; a first top plate (80) disposed on a right-side terminus of the top surface; a second top plate (110) disposed on a left-side terminus of the top surface; a second loop conductor (90) disposed between the first and second top plates; the second loop conductor including: a second loop plate (92) extending from a top-front periphery (T-F′) about the top surface of the substrate; anda pair of second loop connection elements (91; 93), each of the second loop connection elements coupled to the second loop plate and extending to a top-rear periphery (T-R′), a fourth top gap (3d) separating the pair of second loop connection elements, wherein one of said pair of second loop connection elements is coupled to the first vertical conductor element of the high frequency element and the other of said pair of second loop connection elements is coupled to the first vertical portion of the first loop conductor;the second loop conductor being separated from the first top plate by a fifth gap extending therebetween;a third loop conductor (100) disposed between the second loop conductor and the second top plate; the third loop conductor including: a third loop plate (102) extending from the top-front periphery about the top surface of the substrate; anda pair of third loop connection elements (101; 103), each of the third loop connection elements coupled to the third loop plate and extending to the top-rear periphery, a second top gap (3b) separating the pair of third loop connection elements, wherein one of said pair of third loop connection elements is coupled to the second vertical portion of the first loop conductor and the other of said pair of third loop connection elements is coupled to the second vertical conductor element of the low frequency element;the third loop conductor being disposed adjacent to the second top plate and separated therefrom by a first top gap (3a) extending therebetween, the third loop conductor being further separated from the second loop conductor by a third top gap (3c) extending therebetween; anda plurality of front pads (120; 130; 140; 150) disposed on a front surface of the substrate at a bottom-front periphery (B-F′); wherein the substrate comprises one or more voids (160; 170; 180) extending into the substrate volume from the front surface.
地址 Escondido CA US