SEMICONDUCTOR PELLET, METHOD OF ITS PACKAGING, AND BUMP ELECTRODE

摘要

A semiconductor pellet having bump electrodes on external terminals. The bump electrode comprises a laminate structure of a Pb layer and a thinner Sn layer on the surface of the external terminal. In this way, the semiconductor pellet can be connected to the surface of a resin substrate having a low heat resistance through the bump electrode without using a low-melting preparatory solder. A semiconductor device with an increased number of pins can be realized by connecting the semiconductor pellet through the bump electrodes to a resin substrate having a low heat resistance. The yield of the semiconductor device can be improved by using the semiconductor pellet with the bump electrodes, together with a resin substrate having a low heat resistance.