BOND HEADS FOR THERMOCOMPRESSION BONDERS, THERMOCOMPRESSION BONDERS, AND METHODS OF OPERATING THE SAME

摘要

A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.

主权项

1. A thermocompression bonder comprising:
a workpiece supply station including a plurality of workpieces; a bonding station; a placer tool for receiving a workpiece from the workpiece supply station, and for bonding the workpiece to a substrate at the bonding station; and a cooling station for cooling the placer tool after bonding the workpiece to the substrate.