| 摘要 |
The present invention relates to a leaf spring for a micro-cutting device, and a micro-cutting device having the leaf spring. The leaf spring comprises: a holder unit taking a plate shape and having a holder hole with a predetermined inner diameter; and a spring unit of a predetermined thickness, which is integrally formed in the holder hole of the holder unit, can be elastically transformed, and vibrated by vibrations transmitted from the outside, and having a cutting tool provided on the upper surface of a central portion thereof. As the leaf spring is symmetrical in the radial direction around the cutting tool, power is evenly distributed, thus the cutting tool is not shaken in the lateral direction while being operated. Therefore, the leaf spring is capable of performing very precise and continuous processing operation. Specifically, the leaf spring provides excellent safety in vibration cutting in a high frequency range, and has high stiffness and durability due to the distribution of power. |
