发明名称 |
Laminate printed board and manufacturing method thereof |
摘要 |
The present invention provides a laminate printed board having a novel structure that is able to ensure alignment accuracy of the interboard terminals soldered to one printed board and that is also able to achieve a simplification of the process of soldering the interboard terminals. Through-hole lines in which a plurality of through-holes extend in lines are formed on a first printed board. Additionally, a press-fitting fastener hole is formed within the through-hole lines and a first end of an interboard terminal is press-fitted and fastened to the press-fitting fastener hole. Additionally, first ends of others of the interboard terminals are inserted through and flow soldered to through-holes on the first printed board. |
申请公布号 |
US8824164(B2) |
申请公布日期 |
2014.09.02 |
申请号 |
US201213550883 |
申请日期 |
2012.07.17 |
申请人 |
Sumitomo Wiring Systems, Ltd. |
发明人 |
Sakita Tsuyoshi |
分类号 |
H05K1/14;H05K3/36 |
主分类号 |
H05K1/14 |
代理机构 |
Greenblum & Bernstein, P.L.C. |
代理人 |
Greenblum & Bernstein, P.L.C. |
主权项 |
1. A laminate printed board having a first printed board and a second printed board spaced apart, the first printed board and the second printed board being mutually connected by a plurality of interboard terminals, both ends of which are inserted through and soldered to a plurality of through-holes provided on the first and second printed boards, wherein
the plurality of through-holes are formed in a line on the first printed board and at least one press-fitting fastener hole passing through the first printed board is formed within the line of through-holes; a first end of one of the interboard terminals is press-fitted and fastened to the press-fitting fastener hole, and the first ends of the other interboard terminals are inserted through and soldered to the through-holes on the first printed board; and second ends of the plurality of interboard terminals are inserted through and soldered to the through-holes on the second printed board. |
地址 |
Mie JP |