发明名称 Methods for forming doped silicon oxide thin films
摘要 The present disclosure relates to the deposition of dopant films, such as doped silicon oxide films, by atomic layer deposition processes. In some embodiments, a substrate in a reaction space is contacted with pulses of a silicon precursor and a dopant precursor, such that the silicon precursor and dopant precursor adsorb on the substrate surface. Oxygen plasma is used to convert the adsorbed silicon precursor and dopant precursor to doped silicon oxide.
申请公布号 US9153441(B2) 申请公布日期 2015.10.06
申请号 US201414184116 申请日期 2014.02.19
申请人 ASM International, N.V. 发明人 Takamure Noboru;Fukazawa Atsuki;Fukuda Hideaki;Niskanen Antti;Haukka Suvi;Nakano Ryu;Namba Kunitoshi
分类号 H01L21/225;H01L21/02;H01L21/22;H01L21/324 主分类号 H01L21/225
代理机构 Knobbe, Martens, Olson & Bear LLP 代理人 Knobbe, Martens, Olson & Bear LLP
主权项 1. A method for depositing doped silicon oxide on a substrate by an atomic layer deposition (ALD) process, the ALD process comprising at least one doped silicon oxide deposition cycle, wherein a doped silicon oxide deposition cycle comprises: contacting the substrate with a silicon precursor; contacting the substrate with a dopant precursor; and contacting the substrate with a reactive species such that a doped silicon oxide is formed.
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