Lid design to seal optical components of a transceiver module

摘要

Techniques and configurations are provided for packaging optoelectronic devices. In particular, a lid component of an optoelectronic device is provided, and the lid component is configured to cover active components of the optoelectronic device. An optically transparent wall is also provided. The optically transparent wall is coated with an anti-reflective material and configured to interface with a section of the lid component. The optically transparent wall is joined with the section of the lid component such that the optically transparent wall and the lid provide a seal for the active components of the optoelectronic device. Additionally, the lid component has a top surface and a plurality of side surfaces that are coupled to the top surface. An optically transparent wall coated with an anti-reflective material adhesively joins to the top surface and one or more side surfaces.

主权项

1. A method comprising:
providing a lid component of an optoelectronic device, wherein the lid component is configured to cover active components of the optoelectronic device with an opaque top surface and a plurality of opaque side surfaces that are coupled to the top surface at a plurality of edges of the top surface; providing an optically transparent side wall that is coated with an anti-reflective material and configured to interface with the top surface of the lid component and one or more opaque side surfaces of the lid component; joining the optically transparent side wall with the lid component using a sealing component that bonds the optically transparent wall to the opaque top surface of the lid component and one or more of the plurality of opaque side surfaces of the lid component.