| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of easily peeling off a tape stuck on a wafer.SOLUTION: The semiconductor manufacturing apparatus includes: a cutting section that forms a cut for clipping a first tape used for protection of the wafer and a second tape used for peeling off the first tape on a tape for sticking the wafer. The semiconductor manufacturing apparatus also includes a label sticking section that sticks the first tape to the wafer.</p> |
