| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a plating inhibitor 50 from flowing into a recess 20 for forming interconnections.SOLUTION: A method of manufacturing a printed wiring board 1 includes a step for preparing an insulating substrate 10, a step for forming a recess 20 having step-shaped portions 21a, 21b, where the sidewall 22 in the length direction of an interconnection is formed in step-shape, depending on the pattern of interconnections, in the principal surface 10a of the insulating substrate 10 on which the interconnections are formed, a step for bringing a planar member 40 carrying a plating inhibitor 50 into contact with the principal surface 10a of the insulating substrate 10, a step for plating the insulating substrate 10, and a step for removing the plating inhibitor 50.</p> |
