ACOUSTIC MODULES

摘要

In one embodiment, acoustic devices are formed on a substrate which is then placed on a first HAF layer, a screen, and a second HAF layer. The layers of HAF each have apertures aligned with acoustic ports of the devices. The substrate is heated such that the first layer of HAF adheres to the substrate and the screen and the second layer of HAF adheres to the screen. The substrate is cut to separate the devices into modules. In other embodiments, a waterproof membrane covering the acoustic port of an acoustic module may be bonded to a screen to form a gap such that it moves under pressure until restrained by the screen. In still other embodiments, back volume covers for acoustic devices are formed by stacking and heating a first HAF layer, a glass-reinforced epoxy laminate layer, a second HAF layer, and a top layer on a substrate.

主权项

1. A method for acoustic module manufacture, the method comprising:
forming a plurality of acoustic devices on a substrate, each of the plurality of acoustic modules including at least one acoustic port; placing the substrate on at least one first layer of heat activated film, at least one screen layer, and at least one second layer of heat activated film wherein the at least one first layer of heat activated film and the at least one second layer of heat activated film each include a plurality of apertures aligned with acoustic ports of the plurality of acoustic device; heating the substrate, the at least one first layer of heat activated film, the at least one screen layer, and the at least one second layer of heat activated film such that the at least one first layer of heat activated film adheres to the substrate and the at least one screen layer and the at least one second layer of heat activated film adheres to the at least one screen layer; and cutting the substrate to separate the plurality of acoustic devices into acoustic device modules.