发明名称 FLEXIBLE WIRING BOARD, PACKAGE STRUCTURE, AND LIQUID JET HEAD
摘要 <p>PROBLEM TO BE SOLVED: To provide a flexible wiring board which achieves excellent fracture resistance against bending.SOLUTION: A flexible wiring board includes: wiring 56 which is formed extending; a terminal 55 which is electrically connected with the wiring 56 and is mounted connected with an electrode terminal 81 at the exterior by solder; a bending part 58 which bends in a direction that intersects with an extension direction of the wiring 56; and a width extension part 57 which is provided in the wiring 56a between the bending part 58 and the terminal 55 and is formed wider than a width of the wiring 56a at the terminal 55 side.</p>
申请公布号 JP2015173178(A) 申请公布日期 2015.10.01
申请号 JP20140048058 申请日期 2014.03.11
申请人 SEIKO EPSON CORP 发明人 TAKABE HONKI
分类号 H05K1/02;B41J2/01;H05K1/14 主分类号 H05K1/02
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