发明名称 |
FLEXIBLE WIRING BOARD, PACKAGE STRUCTURE, AND LIQUID JET HEAD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a flexible wiring board which achieves excellent fracture resistance against bending.SOLUTION: A flexible wiring board includes: wiring 56 which is formed extending; a terminal 55 which is electrically connected with the wiring 56 and is mounted connected with an electrode terminal 81 at the exterior by solder; a bending part 58 which bends in a direction that intersects with an extension direction of the wiring 56; and a width extension part 57 which is provided in the wiring 56a between the bending part 58 and the terminal 55 and is formed wider than a width of the wiring 56a at the terminal 55 side.</p> |
申请公布号 |
JP2015173178(A) |
申请公布日期 |
2015.10.01 |
申请号 |
JP20140048058 |
申请日期 |
2014.03.11 |
申请人 |
SEIKO EPSON CORP |
发明人 |
TAKABE HONKI |
分类号 |
H05K1/02;B41J2/01;H05K1/14 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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