发明名称 MULTILAYER ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 The present disclosure enhances the design flexibility of a multilayer electronic device. A multilayer electronic device is formed by alternately stacking, in a top-bottom direction, substrate layers in which substrates are disposed and a component layer in which at least one component is disposed. A non-superposing region in which a substrate of a first substrate layer positioned on the upper side of a first component layer is not superposed on a substrate of a second substrate layer positioned on the lower side of the first component layer, as viewed from above, is formed in the substrate. Accordingly, within the multilayer electronic device, a space in which the substrate of the second substrate layer is not located can be formed in a region under the non-superposing region of the substrate of the first substrate layer. By using this space, the design flexibility of the multilayer electronic device can be enhanced.
申请公布号 US2015282327(A1) 申请公布日期 2015.10.01
申请号 US201514737645 申请日期 2015.06.12
申请人 Murata Manufacturing Co., Ltd. 发明人 OTSUBO Yoshihito;OGAWA Nobuaki
分类号 H05K1/18;H05K3/46;H05K1/02 主分类号 H05K1/18
代理机构 代理人
主权项 1. A multilayer electronic device formed by alternately stacking substrate layers and a component layer in a top-bottom direction, a substrate being disposed in each of the substrate layers and at least one component being disposed in the component layer, wherein a non-superposing region is formed in a substrate of an upper substrate layer, which is a substrate layer positioned on an upper side of the component layer, and/or a substrate of a lower substrate layer, which is a substrate layer positioned on a lower side of the component layer, and in the non-superposing region, the substrate of the upper substrate layer and the substrate of the lower substrate layer are not superposed on each other, as viewed from above.
地址 Kyoto JP