MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY

摘要

A method of manufacturing a semiconductor device that can be transferred to a circuit board with improved product reliability, and a semiconductor device manufactured according to the method, are described. A non-limiting example of the manufacturing method includes preparing a wafer having multiple semiconductor die portions formed on the semiconductor wafer, performing a sawing operation to separate the multiple semiconductor die portions into multiple discrete semiconductor die, arranging the multiple discrete semiconductor die on an adhesive member, encapsulating the multiple semiconductor die using an encapsulant, and performing a second sawing operation upon the encapsulated multiple semiconductor die to produce multiple individual encapsulated semiconductor devices.

主权项

1. A method of manufacturing a semiconductor device, the method comprising:
receiving a semiconductor wafer comprising a plurality of semiconductor die portions; performing a first sawing operation on the semiconductor wafer to separate the semiconductor wafer into a plurality of discrete semiconductor die, each discrete semiconductor die comprising:
a first surface;a second surface opposite the first surface;a plurality of side surfaces connecting the first surface to the second surface;a bond pad on the first surface; anda conductive member extending from the bond pad in a direction perpendicular to the first surface; arranging the plurality of discrete semiconductor die at a spacing distance from one another on an adhesive member such that the first surface of each of the plurality of discrete semiconductor die contacts the adhesive member; applying an encapsulant to the plurality of discrete semiconductor die and to the adhesive member to produce an encapsulated plurality of semiconductor die; and performing a second sawing operation upon the encapsulated plurality of semiconductor die, to produce a plurality of individual encapsulated semiconductor devices.