WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board in which the surface of an insulation layer can be made flatter and which is excellent in the filling property of underfills.SOLUTION: A method of manufacturing a wiring board includes: a step for forming a resin composition layer 30X including a first photosensitive resin composition layer 32X joined to a substrate 20 and a second photosensitive resin composition layer 34X of an alkaline development type joined to the first photosensitive resin composition layer; a step for performing patterning of the second photosensitive resin composition layer by a photo-lithography method; and an exposure step for exposing the patterned second photosensitive resin composition layer and the first photosensitive resin composition layer.