SEMICONDUCTOR BUMP-BONDED X-RAY IMAGING DEVICE

摘要

A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.

主权项

1. An x-ray imaging device comprising:
a direct conversion detector substrate having detector pixels for collecting electronic signals generated in response to incident radiation; a readout substrate having readout pixels for receiving said electronic signals; and bump bonds connecting said detector pixels and readout pixels, said bump bonds comprising rigid portions in the form of pillars.