MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITIES AND METHODS FOR THE FABRICATION THEREOF

摘要

Microelectronic packages and methods for producing microelectronic packages are provided. In one embodiment, the method includes bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece. The first MEMS die and cap piece are bonded such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer. A second MEMS die having a second MEMS transducer structure thereon is further bonded to one of the cap piece and the second MEMS die. The second MEMS die and the cap piece are bonded such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer. The second hermetically-sealed cavity contains a different internal pressure than does the first hermetically-sealed cavity.

主权项

1. A method for fabricating a microelectronic package, comprising:
bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer; and bonding a second MEMS die having a second MEMS transducer structure thereon to one of the cap piece and the second MEMS die such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer, the second hermetically-sealed cavity containing a different internal pressure than does the first hermetically-sealed cavity.