发明名称 |
FORMING RESISTIVE RANDOM ACCESS MEMORIES TOGETHER WITH FUSE ARRAYS |
摘要 |
A resistive random access memory array may be formed on the same substrate with a fuse array. The random access memory and the fuse array may use the same active material. For example, both the fuse array and the memory array may use a chalcogenide material as the active switching material. The main array may use a pattern of perpendicular sets of trench isolations and the fuse array may only use one set of parallel trench isolations. As a result, the fuse array may have a conductive line extending continuously between adjacent trench isolations. In some embodiments, this continuous line may reduce the resistance of the conductive path through the fuses. |
申请公布号 |
US2015280123(A1) |
申请公布日期 |
2015.10.01 |
申请号 |
US201514738453 |
申请日期 |
2015.06.12 |
申请人 |
Micron Technology, Inc. |
发明人 |
Redaelli Andrea;Pirovano Agostino;Meotto Umberto Maria;Servalli Giorgio |
分类号 |
H01L45/00;H01L27/24 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
forming a chalcogenide memory array including forming select devices by forming two sets of orthogonal trenches, wherein said forming a chalcogenide memory array includes performing a process flow; and forming a fuse array on a same substrate as the chalcogenide memory array, wherein said forming the fuse array includes performing the process flow. |
地址 |
Boise ID US |