发明名称 LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining apparatus that can suppress deviation of a quality modification region to be formed, from a planned cutting line. <P>SOLUTION: A laser beam is emitted with a converging point focused on the inside of a workpiece 1, so that the quality modification region to be a cutting starting point is formed inside the workpiece 1 along the plurality of planned cutting lines set in the workpiece 1. Then, in the workpiece 1, in order of a region Z1 on the near side, a region Z2 on the deep side, and a region Z3 in the center, the quality modification region is formed along the planned cutting lines extending in these regions. Consequently, this can reduce the effect of the moving workpiece during the laser beam machining, compared with the machining on the machining order of general planned cutting lines,. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008087026(A) 申请公布日期 2008.04.17
申请号 JP20060270876 申请日期 2006.10.02
申请人 HAMAMATSU PHOTONICS KK 发明人 MURAMATSU KENICHI
分类号 B23K26/38;B23K26/00;B23K26/06;B23K26/40;B23K101/40;C03B33/09;H01L21/301 主分类号 B23K26/38
代理机构 代理人
主权项
地址