| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metallized substrate that enhances light-emission efficiency while efficiently discharging light, emitted from a semiconductor light-emitting element, to the outside; maintains a thickness of a solder layer when the semiconductor light-emitting element is bonded; improves bonding strength of a semiconductor device while improving adhesion between the solder layer and an electrode of the metallized substrate; and minimizes resistance between a device terminal and a substrate electrode. <P>SOLUTION: The metallized substrate is composed of a ceramic substrate, a first active metal layer formed on the ceramic substrate, an aluminum electrode formed on the first active metal layer, a barrier layer formed on at least a part of the surface of the aluminum electrode, and the solder layer formed on the barrier layer. <P>COPYRIGHT: (C)2008,JPO&INPIT |
