| 摘要 |
A mold fill system includes a fill head, at least one solder input port, at least one solder output port, disposed on the leading edge of the fill head body, a mold plate, the fill head body being held near the mold plate, including a plurality of mold pits for injection molded solder and at least one o-ring disposed between the fill head body and the mold plate, for sealing the solder between the fill head body and the mold plate. An input velocity of the solder is sufficient to dislodge air trapped within the mold pits, and a circulartion pump is disposed on either a fill side or a return side of the fill head body to re-circulate the solder between the solder reservoir and the fill head. Optionally, heated plumbing connects the circulation pump, the fill head and the reservoir.
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