Semiconductor component i.e. film semiconductor component, or element group manufacturing method, involves forming semiconductor material with layer sequence, and arranging electrical connection area on side facing carrier layer

摘要

The method involves forming a semiconductor material containing a layer sequence (5) on a growth substrate (1). The layer sequence is applied on a carrier layer (2), and an electrical connection area (4) is arranged on a side facing the carrier layer. Another electrical connection area is arranged on a radiation decoupling surface of the layer sequence facing the carrier layer. The connection area is electrically connected with a decouple-sided conductive strip. Independent claims are also included for the following: (1) a thin film semiconductor component (2) an element group.