| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a module component and its manufacturing method that can increase the unity of a semiconductor chip and a substrate, and to improve their mechanical strength without being influenced by the semiconductor chip's thickness, and heighten the connection reliability of the semiconductor chip and the substrate. <P>SOLUTION: The module component 10 has a circuit substrate 11 having a flat plate section 13, and a semiconductor chip 12 having an input/output electrode 12A on the upper surface and mounted onto a flat plate section 13 so that the lower surface becomes a mounting surface. The circuit substrate 11 is provided with a columnar electrode 14 having an end surface in the same side as the input/output electrode side 12A of the semiconductor chip 12 and a support 15 supporting the peripheral side of the columnar electrode 14, the end surface of the columnar electrode 14 is formed as a surface electrode 14A, and the surface electrode 14A and the input/output electrode 12A are connected by a re-wiring line 18 formed on the same surface as they are. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
