| 摘要 |
A cooling device is provided for an electronic unit. In some implementations, the cooling device includes a cooling body, arranged in an essentially airtight sealed housing of the electronic unit, through which a cooling medium may flow. Heat generating elements, for example electronic components, are mounted on the cooling device so as to release the heat to the cooling body by contact transmission. Additional heat exchange means for cooling the air enclosed in the housing are connected to the cooling body with a thermal conducting connection and arranged on said cooling body. Such a cooling device can be produced with a compact construction with effective heat extraction.
|
