发明名称 Substrate treatment apparatus
摘要 A substrate treatment apparatus is provided. The substrate treatment apparatus includes a process room, a load port in which a container receiving wafers is disposed, and a wafer transfer module disposed between the load port and the process room to transfer the wafers between the load port and the process room. The wafer transfer module includes a first barrier, a second barrier extending from a first end of the first barrier or from a portion near the first end of the first barrier at a predetermined inclined angle with respect to the first barrier, and a third barrier extending from a second end of the first barrier or from a portion near the second end of the first barrier at a predetermined inclined angle. The load portion is provided along the first barrier. The process room includes a plurality of chambers arranged along the second and third barriers.
申请公布号 US2007217896(A1) 申请公布日期 2007.09.20
申请号 US20070711124 申请日期 2007.02.27
申请人 KIM KI-SANG;CHOI KYUE-SANG;SEO BYONG-KYU;PARK SOON-CHON 发明人 KIM KI-SANG;CHOI KYUE-SANG;SEO BYONG-KYU;PARK SOON-CHON
分类号 H01L21/677;B05C13/00;B66C23/00 主分类号 H01L21/677
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