发明名称 |
Substrate treatment apparatus |
摘要 |
A substrate treatment apparatus is provided. The substrate treatment apparatus includes a process room, a load port in which a container receiving wafers is disposed, and a wafer transfer module disposed between the load port and the process room to transfer the wafers between the load port and the process room. The wafer transfer module includes a first barrier, a second barrier extending from a first end of the first barrier or from a portion near the first end of the first barrier at a predetermined inclined angle with respect to the first barrier, and a third barrier extending from a second end of the first barrier or from a portion near the second end of the first barrier at a predetermined inclined angle. The load portion is provided along the first barrier. The process room includes a plurality of chambers arranged along the second and third barriers.
|
申请公布号 |
US2007217896(A1) |
申请公布日期 |
2007.09.20 |
申请号 |
US20070711124 |
申请日期 |
2007.02.27 |
申请人 |
KIM KI-SANG;CHOI KYUE-SANG;SEO BYONG-KYU;PARK SOON-CHON |
发明人 |
KIM KI-SANG;CHOI KYUE-SANG;SEO BYONG-KYU;PARK SOON-CHON |
分类号 |
H01L21/677;B05C13/00;B66C23/00 |
主分类号 |
H01L21/677 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|