PACKAGE-ON-PACKAGE WITH CAVITY FORMED AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide package-on-package and its manufacturing method.

SOLUTION: A manufacturing method of package-on-package with cavities formed comprises: a stage of forming a first upper-layer cavity 475 in one surface of an upper-layer substrate; a stage of mounting an upper-layer semiconductor chip 480 on the other surface of the upper-layer substrate; a stage of forming a lower-layer cavity in one surface of the lower-layer substrate; a stage of mounting a lower-layer semiconductor chip 435 in the lower-layer cavity formed in the lower-layer substrate; and a stage of stacking the upper-layer substrate on the lower-layer substrate in such a manner that a part of the lower-layer semiconductor chip is accommodated in the first upper-layer cavity. Since the cavity is formed in the upper and lower layer substrates to accommodate the semiconductor chip mounted on the lower-layer substrate in the cavity, the package-on-package with the cavities formed and its manufacturing method can reduce the entire thickness of the package.

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