发明名称 |
POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE |
摘要 |
A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.
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申请公布号 |
US2007200127(A1) |
申请公布日期 |
2007.08.30 |
申请号 |
US20070689868 |
申请日期 |
2007.03.22 |
申请人 |
ANDREWS PETER S;LOH BAN P |
发明人 |
ANDREWS PETER S.;LOH BAN P. |
分类号 |
H01L29/22;H01L29/227;H01L29/24;H01L33/48;H01L33/54;H01L33/58;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L29/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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